1. Electroless plating is a process used to deposit a uniform layer of metal on a substrate without the use of an external electric current.
电镀是一种在基材上均匀沉积金属层的过程，而无需使用外部电流。

2. The electroless method of plating is widely used in the manufacture of printed circuit boards.
化学电镀的方法在印刷电路板制造中被广泛应用。